STM and JESDAF respectively. A typical Human Body Model circuit is presented in Figure 1. Figure 1: Typical Human Body Model Circuit. In September , a small group of ESD control and design stakeholders assembled in a Read More». In the EERC Resource Center. A Dash of Maxwell’s. JESDAF. – IEC (C= pF). – MIL method Pulse parameters. HBM. Reference voltage. 2KV 4KV. Peak current. A A.
|Published (Last):||18 December 2010|
|PDF File Size:||19.91 Mb|
|ePub File Size:||20.78 Mb|
|Price:||Free* [*Free Regsitration Required]|
Requirement, clause number Test method number Clause number The referenced clause number has proven to be: Attach a shorting wire between these pins with the current probe around the shorting wire. Place the current probe around the shorting wire. A voltage probe with a minimum input impedance of 10M? Due to this effect the current waveform seen at Terminal B would not match the one seen using a non-relay, 2-pin HBM test between the same set of pins.
The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint.
The V level is optional. Testing must be performed using an actual device chip. All pins one at time to Gnd3 power pin group 4. It is permitted to use a separate sample of 3 devices for each pin combination set specified in Table 2.
If the Supply pins are connected on package plane clause 4. Some punctuation changes are not included.
Active discrete devices FETs, transistors, etc. Additionally, all personnel shall receive system operational training and electrical a114r training prior to using the equipment. All pins one at time to Vdd3 power pin group 6. Connect this pin to Terminal B where it will remain the referenced pin throughout the worst-case pin search and connect one of the remaining pins to Terminal A.
However, if a pin intended to supply power to a circuit on another chip but not to any circuit on the same chip, it may be treated as a signal pin. However, if another higher starting voltage level is used and the device fails, testing shall be restarted with a fresh device at the next lowest level.
As an alternative to this method, it is permitted to partition the pins to be connected to terminal B into two or more subsets, such that each jesd222 these pins is a member of at least one subset. Follow the procedure in step 3. It is permitted to use the same sample 3 at the next higher voltage stress level if all parts pass the failure criteria specified in clause 5 after ESD exposure to a specified voltage level.
Each non-supply pin to all other non-supply pin; all power pins left unconnected. NOTE 6 S2 shall be closed at least 10 milliseconds after the pulse z114f period to ensure the DUT socket is not left in a charged state. 1a14f pin that is connected to an internal power bus or a power pin by metal must be treated as a power pin example: Jead22 tester must meet the requirements of Table 1 and Figure 2 at all voltage levels, except V, using the shorting wire and at the V and V levels with the ?
If at any time the waveforms do not meet the requirements defined within Figure 2 and Table 1 at the V or V level, the testing shall be halted until the waveform is in compliance. It is permitted to use a separate sample of 3 devices for each pin combination set specified in Table 2. If the Supply pins are connected on package plane clause 4.
Example of proposed changes being utilized Test Flow 1 HBM testing will be done in adherence to Table 2, with selected pin combinations replaced by alternative pin combinations. Jesv22 simulator must be capable of s114f pulses with the characteristics required by Figure 2 and Figure 3. Recalibration is required whenever equipment repairs are made that may affect the waveform and a minimum of every 12 months. All pins one at time to Gnd1 power pin group 2.
In case the waveform no longer meets the limits in Table 1, all ESD testing performed after the previous satisfactory waveform check will be considered invalid. All pins one at time to Vdd1 power pin group 5.
When replacing only a single polarity of a given combination, the jssd22 polarity shall be used when adopting this reverse pin combination alternative. Apply a positive and negative V pulse and verify that the waveform meets the requirements defined in Table 1. NOTE As an alternative to the worst-case pin search, the reference pin pair may be identified for each test socket of each test fixture. Each Vdd2 pin Vdd2. All pins one at time to Vdd1 power pin group 5. Clarified that pin combination sets may be partitioned as far as necessary and performed on different devices to eliminate possible cumulative effects.
Attach a shorting jesc22 between these pins with the current probe around the shorting wire, as close to Terminal B as practicable. Power pins that are directly connected by metal inside the package form a power pin group. The V jed22 is optional.
The characteristics of this pre-pulse phenomenon depend on the conditions and the environment of the arcing associated with the HBM discharge, the parasitic capacitances of the tester, as well as the pin impedance of the device under test.
The simulator must be capable of supplying pulses with the characteristics required by Figure 2 and Figure 3. If you can provide a114c, please complete this form and return to: This shunt resistance can be placed in the HBM simulator or in the test fixturing system. Connect this pin to Terminal B and then connect the socket pin s114f the longest wiring path from the pulse generating circuit to the test socket to Terminal A normally provided by the manufacturer.
Due to lack of specifications for this phenomenon, the magnitude of the resulting voltage rise at the stressed pin may vary significantly from tester to tester and can alter the behaviors jesx22 some ESD protection circuits.
NOTE As an alternative to the worst-case pin search, the reference pin pair may be identified for each test socket of each test fixture. JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. The other pins in the group do not need to be stressed. The characteristics of this pre-pulse phenomenon depend a114 the conditions and the environment of the arcing associated with the HBM discharge, the parasitic capacitances of the tester, as well as the pin impedance of a141f device under test.
Other suggestions for document improvement: Any part that passes after exposure to an ESD pulse of V.