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A clearance between the soldering terminal portion and a print circuit board side should be less than 0.
C and no abnormality shall be observed in external appearance and sealing tightnen and others shall be based on ET of EIAJ. Also, no serial bubble is observed by Fluorocarbon tests. C 3cycles 18times drop from cm heights to concrete.
Mount the specimen on substrate.
Underfilling Material for DSXG Types,KDS considers underfilling material such as heat-cured resin would not affect the characteristics of the DSXG crystal mounted, kda, we recommend the crystal be tested and checked in such a case prior to use so that there are the possibility that the crystal may have a cap off or a crack in the ceramic base.
Be sure to have a mounting test in advance by using the actual mounting machine and check that the characteristics of the products are not damaged by the automatic mounting. Apply the following pressure Weight: However please consult in advance about other washing liquid. Please keep it in the place which direct rays do not hit and dew condensation does not generate. The empty embossed area which are sealed by cover-tape must remain more than 40mm.
Please refrain from forming patterns between crystal land pattern’s since there is a possibility to cause crack in base. C perform the attached Dsx321b conditions to reference. C and no abnormal appearance shall be observed.
Glass Epoxy 1 cycle: It is a guaranteed term because it obtains an excellent soldering: However when too much shock is added according to a certain cause, the use after a characteristic check is recommended. Avoid using the product at temperature higher than specified. In the process where the boad is warped, such as board separation process, be careful that the warping does not influence the characteristics and soldering of crystal products.
Further,parts shall be solderd on substrate, fixed Aluminum materials about g. C and no abnormality shall be observed in external appearance and sealing tightness and others shall be based on ET of EIAJ. Although the check about ultrasonic washing is performed, since it is an examination with a simple substance, the check for the second time by the use state is recommended. C Transport Time min ?
C 10 s s 60 s Total time: The tip of cover-tape shall be fixed temporary by paper tape and roll around the core of reel one round.
Since mounting by Ultrasonic welding and processing have a possibility of an excessive vibration spreading inside a crystal resonator and becoming the cause of characteristic deterioration and not oscillating, it does not recommend.
Sine waves krs 1. Please use it below with the value specified on a catalog and specifications. In the upper and lower part and the opening in box it shall be protected products using aircushion sheets. M Plating material of a terminal. C 30min 1 cycle After all products were packaged, must remain more than twenty pieces or mm empty area, which should be sealed by cover-tape. Reflow soldering shall be allowed only 3 times.